Research on Liquid Cooling Test Technology of Ceramic Substrate Packaging Embedded Microchannel

In order to achieve the liquid cooling test of embedded microchannels in ceramic substrates, a test method of liquid cooling is designed, and special test equipment and test flow are developed in this paper. The equipment mainly consists of three aspects: refrigeration, coolant delivery, and electrical components. To meet the thermal testing requirements, a ceramic thermal test chip is designed and fabricated using a multilayer co-firing process to simulate chip heating and test package heat dissipation performance. Furthermore, the feasibility of using liquid metal and nanofluids as working fluids is investigated to enhance heat dissipation effectiveness. Experimental results indicate that due to high viscosity, existing liquid metals are not suitable for products with ceramic substrate packaging embedded microchannel. However, all five commercialized nanofluids show promising application effects, with diamond nanofluid No. 3 demonstrating the best heat dissipation performance.