材料科学
环氧树脂
纳米复合材料
复合材料
热导率
抗弯强度
电阻率和电导率
导电体
断裂韧性
热的
石墨烯
相(物质)
数码产品
电磁屏蔽
聚合物纳米复合材料
韧性
弯曲模量
聚合物
渗流阈值
热稳定性
碳纳米管
电子包装
柔性电子器件
作者
Yue Sun,Ziyuan Chai,Yong He,Yunting Su,Mingxue Li,Lei Jiang,Liping Heng
标识
DOI:10.1002/adfm.202516608
摘要
Abstract The rapid development of aerospace, automotive, and advanced electronics industries has necessitated the development of multifunctional materials featuring high flexural strength, fracture toughness, and superior electrical and thermal conductivity. Incorporating bio‐inspired conductive scaffolds into tough polymer matrices represents a promising strategy to address these comprehensive performance requirements. However, existing bulk nanocomposites typically exhibit limited electrical and thermal conductivity, insufficient for increasingly demanding technological applications. In this study, electron and phonon transport within an epoxy (EP) matrix are significantly enhanced by introducing a continuous liquid metal (LM) phase into a reduced graphene oxide/polyimide scaffold (PrGO). The resulting EP/PrGOLM nanocomposite exhibits outstanding flexural strength (144.9 MPa) and fracture toughness (4.55 MPa m 1/2 ), combined with ultrahigh electrical conductivity (53379 S m −1 ) and thermal conductivity (18.4 W m −1 K −1 ). Due to this exceptional combination of properties, the EP/PrGOLM nanocomposite achieves remarkable average electromagnetic interference (EMI) shielding effectiveness (SE) over X‐band up to 78 dB at a small thickness of 0.1 mm, while its specific SE (780 dB mm −1 ) surpasses current records reported for bulk nanocomposites. These results clearly demonstrate that the EP/PrGOLM nanocomposite holds substantial potential for advanced applications in aerospace, automotive, and next‐generation electronic devices.
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