捷克先令
溶胶凝胶
材料科学
化学工程
相(物质)
图层(电子)
纳米技术
化学
有机化学
工程类
作者
Dongmei Xiang,Aimei Zhao,Bing Li,Zhuo Peng,Yujie Yuan,Yupeng Xing,Liyong Yao,Jinlian Bi,Wei Li,Xiaoyong Zhang
标识
DOI:10.1016/j.mssp.2022.106784
摘要
The traditional sol-gel process usually takes a long time to form a stable Cu2ZnSnS4 (CZTS) sol-gel solution, which increases the whole process time. In this paper, an electrodeposition assisted sol-gel process was employed to reduce the solution preparation time. Cu was electrodeposited on Mo surface and ZnSnS sol-gel was rotated on Cu surface to prepare CZTS films. The solution preparation time was reduced from 12h to 30min. The mechanism of CZTS phase formation with sol-gel method assisted by electrodeposition was studied. Cu3SnS4 phase was formed during the electrodeposition assisted sol-gel process, while Cu2SnS3 phase was formed when the CZTS precursor during sol-gel process. Cu content was rich at the beginning of the reaction to form Cu3SnS4 during the electrodeposited assisted sol-gel process. CZTS films with Cu/(Zn + Sn) of 0.84 and Zn/Sn of 1.03 were prepared by sol-gel method assisted by electrodeposition. Compared with CZTS films prepared by sol-gel method, CZTS films prepared by this method have larger and more uniform grains. It is also found that the thickness of MoS2 layer was thinner than the one prepared by sol-gel method.
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