溅射
蒸发
物理气相沉积
电子束物理气相沉积
沉积(地质)
等离子体
阴极电弧沉积
薄膜
溅射沉积
汽化
涂层
电离
离子镀
材料科学
电弧
原子物理学
化学
离子
纳米技术
阴极保护
电极
古生物学
沉积物
有机化学
量子力学
物理化学
物理
热力学
生物
电化学
作者
Jón Tómas Guðmundsson,André Anders,Achim von Keudell
标识
DOI:10.1088/1361-6595/ac7f53
摘要
Abstract Physical vapor deposition (PVD) refers to the removal of atoms from a solid or a liquid by physical means, followed by deposition of those atoms on a nearby surface to form a thin film or coating. Various approaches and techniques are applied to release the atoms including thermal evaporation, electron beam evaporation, ion-driven sputtering, laser ablation, and cathodic arc-based emission. Some of the approaches are based on a plasma discharge, while in other cases the atoms composing the vapor are ionized either due to the release of the film-forming species or they are ionized intentionally afterward. Here, a brief overview of the various PVD techniques is given, while the emphasis is on sputtering, which is dominated by magnetron sputtering, the most widely used technique for deposition of both metallic and compound thin films. The advantages and drawbacks of the various techniques are discussed and compared.
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