电介质
半导体
硅
带隙
晶体管
绝缘体(电)
单层
绝缘体上的硅
工程物理
材料科学
纳米技术
电压
光电子学
电气工程
物理
工程类
作者
Michal J. Mleczko,Chaofan Zhang,Hye Ryoung Lee,Hsueh-Hui Kuo,Blanka Magyari-Köpe,R. G. Moore,Zhi‐Xun Shen,I. R. Fisher,Yoshio Nishi,Eric Pop
出处
期刊:Science Advances
[American Association for the Advancement of Science]
日期:2017-08-04
卷期号:3 (8)
被引量:231
标识
DOI:10.1126/sciadv.1700481
摘要
The success of silicon as a dominant semiconductor technology has been enabled by its moderate band gap (1.1 eV), permitting low-voltage operation at reduced leakage current, and the existence of SiO2 as a high-quality "native" insulator. In contrast, other mainstream semiconductors lack stable oxides and must rely on deposited insulators, presenting numerous compatibility challenges. We demonstrate that layered two-dimensional (2D) semiconductors HfSe2 and ZrSe2 have band gaps of 0.9 to 1.2 eV (bulk to monolayer) and technologically desirable "high-κ" native dielectrics HfO2 and ZrO2, respectively. We use spectroscopic and computational studies to elucidate their electronic band structure and then fabricate air-stable transistors down to three-layer thickness with careful processing and dielectric encapsulation. Electronic measurements reveal promising performance (on/off ratio > 106; on current, ~30 μA/μm), with native oxides reducing the effects of interfacial traps. These are the first 2D materials to demonstrate technologically relevant properties of silicon, in addition to unique compatibility with high-κ dielectrics, and scaling benefits from their atomically thin nature.
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