Nano Particle Control on 300mm-wafers in Supercritical Fluid Technology

The nano particle control in the supercritical fluid technology using CO2 (SCCO2) is extremely essential for SCCO2 to enter a 300 mm-Si-wafer semiconductor industry as a viable technology. In this study, we explored the basic particle removal behavior of SCCO2, varying the process recipe of the SCCO2 operation and the size of nano particles (PSL: polystyrene latex). The SCCO2 with Methanol as a non-solvent for PSL has indicated that PRE (particle removal efficiency) has the dependency of the nano particle size (weight) and hit the highest level of around 45 % on the smallest PSL (75 nm-dia.) particles. The SCCO2 with Pyridine as a solvent for PSL has shown that its PRE has a similar tendency as seen on Methanol, but indicates a higher level of around 55 % than that of the SCCO2 with Methanol.