Characterizing piezoelectric properties of PVDF film under extreme loadings

材料科学 分离式霍普金森压力棒 复合材料 压电 聚偏氟乙烯 应变率 压力(语言学) 压电系数 动载荷 压电传感器 聚合物 语言学 哲学
作者
Yao Yu,Jialin Li,Zihao Xie,Xiaobo Gong,Guangjun Gao,Jia-Bin Wang,Jian Li
出处
期刊:Smart Materials and Structures [IOP Publishing]
卷期号:33 (1): 015026-015026 被引量:10
标识
DOI:10.1088/1361-665x/ad1266
摘要

Abstract Polyvinylidene fluoride (PVDF) as a polymer has been proven to be an effective piezoelectric sensor with advantages of good flexibility, high mechanical strength, and high chemical resistance. Numerous studies have focused on the response of PVDF film at high strain rates, but few on low strain rate response, and the response of PVDF film at different strain rates is unknown. To address these limitations, we examine the piezoelectric properties of PVDF film at extreme high and low loading rates. We design quasi-static compression and dynamic split Hopkinson pressure bar (SHPB) test setups to examine the response of PVDF film. Quasi-static compression test results show that PVDF films have good repeatability and linearity. The charge shift phenomenon is observed at quasi-static loading conditions, and the charge shift rate is found to be related to the gain coefficient of charge amplifier. Next, SHPB tests are performed and results show that PVDF film can well capture the propagation of stress wave. Moreover, it is observed that the PVDF film under high loading rate has a higher failure strength in comparison to that of low loading rate. Finally, based on the measured points by quasi-static compression and SHPB tests, the piezoelectric coefficients of PVDF film under extreme low (on the scale of strain rate of 10 −2 s −1 ) and extreme high (on the scale of strain rate 10 5 s −1 ) loading rates are found to be 30.79 pC/N and 27.72 pC/N, respectively. Note that, the strain rate difference is seven orders of magnitude, the piezoelectric coefficient difference is only 9.97%. We believe our findings can advance the design and application of PVDF films in practical engineering.
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