Thermal Performance Enhancement in Pool Boiling on Copper Surfaces: Contact Angle and Surface Tension Analysis

The electronics industry has significantly contributed to the development of efficient heat dissipation systems. One widely used technique is pool boiling, a simple method requiring no moving parts or complex structures. It enables the removal of large amounts of heat at relatively low temperature differences. Enhancing pool boiling performance involves increasing the critical heat flux and the heat transfer coefficient, which defines how effectively a surface can transfer heat to a cooling fluid. This method is commonly applied in cooling electronic devices, digital circuits, and power systems. In this study, pool boiling at atmospheric pressure was investigated using copper surfaces. To validate the Rohsenow model used to estimate the maximum bubble departure diameter, a planimetric approach was applied. Measurements included average contact angle (CA), surface tension (σ), and droplet diameter for four working fluids: deionised water, ethanol, Novec-649, and FC-72. For each fluid, at least 15 measurements of CA and σ were conducted using the Young–Laplace model. This study provides a comprehensive analysis of the influence of contact angle and surface tension on nucleate boiling using four different fluids on copper surfaces. The novelty lies in combining high-precision experimental measurements with validation of the Rohsenow model, offering new insights into surface-fluid interactions critical for thermal system performance.