软件部署
计算机科学
半导体工业
政府(语言学)
系统工程
工程管理
工程类
制造工程
软件工程
语言学
哲学
作者
Jonathan Schuster,Meredith Reed,Jagmohan Bajaj,Philip Perconti,E. Bellotti,Francesco Bertazzi
摘要
Future and advanced sensor technologies needed for DoD applications will require more efficient semiconductor materials and devices. Pushing sensor device performance beyond present levels requires a deep understanding of the fundamental limiters. Therefore fundamental research is needed to assure transition of technology from demonstration to system deployment. To address this problem, the Army Research Laboratory (ARL) and Boston University (BU) have come together to create a BU led Consortium for semiconductor Modeling of Materials and Devices (CSM). The Consortium brings together government, academia, and industry in a collaborative fashion to continuously push semiconductor research forward to meet DoD needs. The leveraged attributes of the Consortium include combined broad knowledge base in semiconductor modeling, materials growth and device expertise; sharing of computational resources; project continuity; and extension of the bench. Details regarding the Consortium's first research topic on understanding vertical transport in Type 2 SL will be discussed.
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