Transfer printing of III-V devices for silicon photonics

Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration solution is the heterogeneous integration of the high performing components onto a waveguide platform using the technique of micro-transfer-printing ( μTP). We discuss the requirements to implement μTP technology and how the components are registered, released, transferred and integrated with silicon photonics. We envisage that μTP can enable very smart systems at low enough costs for consumer adoption through volume manufacturing.