材料科学
薄脆饼
单晶硅
光学
反射(计算机编程)
硅
反射率
涂层
纹理(宇宙学)
职位(财务)
光电子学
计算机科学
复合材料
物理
人工智能
图像(数学)
经济
程序设计语言
财务
作者
Stefan Rein,M. Tondorf,Johannes Greulich,A. Krieg
出处
期刊:World Conference on Photovoltaic Energy Conversion
日期:2013-11-22
卷期号:: 1820-1824
被引量:1
标识
DOI:10.4229/28theupvsec2013-2cv.4.56
摘要
The accuracy and reliability of different techniques for inline quality control of antireflection coatings (ARC) on industrial relevant surfaces are analyzed and rules to improve the accuracy of the systems are derived. For this, four systems are compared with respect to the setup and the way of ARC thickness calculation. Raw data and measured thicknesses are evaluated with respect to a reference system, to identify for each surface texture the system which is suited best and to identify the physical reasons for deviations. Angle-dependent simulations and measurements of the spectral reflectance on monocrystalline wafers with a pyramidally-etched surface reveal that different angle corrections for mc-Si and Cz-Si are required. Besides evaluating the spectral position of the reflectance minimum, a least-squares fit of the spectral reflectance of partially textured Cz-Si is presented and evaluated.
科研通智能强力驱动
Strongly Powered by AbleSci AI