散热片
逆变器
炸薯条
表面贴装技术
材料科学
电子工程
计算机科学
电气工程
光电子学
工程类
印刷电路板
电压
作者
Yoshiya Ohnuma,Satoshi Miyawaki,Fumiya Hattori,Masayoshi Yamamoto
出处
期刊:2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia)
日期:2018-05-01
卷期号:: 2738-2742
被引量:1
标识
DOI:10.23919/ipec.2018.8506675
摘要
In this paper, an inverter system consisting of a converter unit with 4 GaN FETs in parallel is proposed. Most GaN FET packages are used for chip type packages. It is difficult for chip type packages to mount a heatsink since a heatsink requires the complicated configuration at the surface. To resolve this problem, a plastic heatsink is installed in the proposed system. A prototype inverter system with maximum efficiency of over 98% is fabricated, and their system losses are analyzed. As a result, it can be confirmed that most part of losses are no-load loss.
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