材料科学
位错
比奥数
压力(语言学)
热膨胀
复合材料
单晶
光学
热的
凝聚态物理
结晶学
机械
热力学
化学
物理
语言学
哲学
作者
Li-hsing Wang,Ming-Hsun Ling
标识
DOI:10.1109/iceeot.2016.7755588
摘要
Solid-state interactions are simulated by computations. The thermal stress produced during the fiber growth by LHPG induced by temperature variations for various Biot number and interface shape of the melt and the solid. Simulations show that maximum stress and dislocation density are produced during the single crystal growth for the growing interface concaving towards the melt with large Biot number. The temperature distribution distant from the interface has little or no difference no matter it is the convexed and the concaved conditions along the axial and radial direction. However, Concaved-interface single crystals have 4.8 times thermal stress (dislocation) higher than convexed-interface at the periphery of the tip. The thermal stresses or dislocation density of the spinel calculated from the optical micrograph photographs show the same trends as the model derived.
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