微电子
腐蚀
原子层沉积
图层(电子)
沉积(地质)
制作
纳米技术
材料科学
薄膜
工程物理
冶金
工程类
地质学
医学
沉积物
病理
古生物学
替代医学
标识
DOI:10.1016/j.cocis.2022.101674
摘要
Atomic layer deposition (ALD) is now a widely implemented thin film growing method. It is currently used in industrial fabrication processes of microelectronics and luminescent display technologies. Since compact and conformal films can be grown with perfect control of the thickness, ALD is envisioned in numerous other applications fields such as energy, sensing, biomaterials, and photonics. Although few reports can be found on its application to corrosion protection, it has been shown that the qualities of ALD can be highly beneficial to this field. After a brief review of the principle of ALD and the effect of the main parameters on the properties of the films, this report attempts to show the interest of this technique to mitigate corrosion. Various examples of successful uses of ALD to protect metallic and non-metallic surfaces in different fields are reviewed.
科研通智能强力驱动
Strongly Powered by AbleSci AI