Low-temperature fabrication of boron-doped amorphous silicon passivating contact as a local selective emitter for high-efficiency n-type TOPCon solar cells

Tunnel oxide passivating contact (TOPCon) solar cells (SCs) currently dominate the photovoltaic industry but grapple with efficiency challenges. A primary concern is the direct contact between front-sided metal electrodes and boron emitters, resulting in substantial carrier recombination losses and limiting further efficiency improvements. Here, we introduce a low-temperature approach to deposit a local boron-doped amorphous silicon [a-Si:H(p)] between front-sided metal electrodes and boron emitters. This method, avoiding issues associated with high-temperature processes, demonstrates excellent passivation and contact properties, featuring the lowest contact resistivity (< 1 mΩ·cm2) and a low saturation current density (< 400 fA/cm2). The outstanding passivation and contact properties remain robust even with variations in diborane flow rates during a-Si:H(p) fabrication, annealing temperatures, and sheet resistances of boron emitters. We elucidate the factors contributing to the enhanced passivation observed in boron emitters with a-Si:H(p) through a combination of simulations and experiments. The a-Si:H(p) layer between boron emitters and metal electrodes acts as a protective barrier, preventing the diffusion of metal atoms and suppressing carrier recombination. A heterojunction is formed between a-Si:H(p) and the boron emitter, facilitating electric-field passivation. Consequently, the TOPCon SCs incorporating a-Si:H(p) achieve an efficiency of 24.50%, surpassing their counterparts without a-Si:H(p) (23.11%). This work utilizes low-temperature technology to achieve fully passivated contact, providing insights for the development of high-efficiency TOPCon SCs.