P‐204: Simulation Study of Temperature Profile on AMOLED Panel Under High Brightness Mode

In this paper, we present a thermal simulation model designed to accurately predict the temperature distribution of AMOLED panel when operating in high brightness mode (HBM). The model incorporates panel geometric parameters, taking into account stacking configuration and material properties of actual OLED panel module. The simulation results demonstrate excellent agreement with the measured temperature distribution, with a maximum temperature difference of less than 1.5°. This thermal simulation model holds significant potential for evaluating OLED display performance and reliability risks associated with temperature increases. It can also serve as a valuable tool for guiding panel wiring design.