芳纶
材料科学
复合材料
复合数
介电强度
比强度
热稳定性
电介质
纤维
光电子学
量子力学
物理
作者
Songjun Yao,Yongbai Liu,Junhui Pei,Jiaqi Wang,Hua Wang,Siwei Xiong,Jing Wu,Shiwen Yang,Luoxin Wang
标识
DOI:10.1016/j.coco.2022.101436
摘要
The rapid development of national defense, military industry, and aerospace puts forward higher requirements to the mechanical property, breakdown strength, dielectric properties, and heat resistance of high-performance aramid paper. However, the vast majority of aramid paper-based materials can hardly have a combination of satisfactory high mechanical properties and breakdown strength due to the porous structure of paper-based materials. Herein, we report a para-aramid chopped fibers/polyphenylene sulfide (ACFs/PPS) composite paper with a sandwich structure by designing the structure of aramid paper. Dense PPS microfiber membrane as robust armor filled and repaired the voids and defects on ACFs/PPS composite paper. Additionally, strong barrier interfaces between PPS film and ACFs/PPS composite paper effectively slow down the transmission of voltage to the inside of the composite paper. Thus we obtain the sandwich-structured ACFs/PPS composite paper with excellent mechanical strength (158.7 MPa) and breakdown strength (55 kV/mm), which are almost 1.5 and 2.5 times higher than ACFs/PPS composite paper, respectively. Besides, excellent mechanical properties and breakdown strength are wonderfully integrated with superior dielectric properties (tanδ <0.0035), chemical stability, and thermal stability (DTGmax > 575 °C), far superior to reported aramid paper-based materials. This work plays an important role in fabricating fabulous multi-attribute combinations of aramid paper-based materials and can also be extended to other materials and structures.
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