Structure analysis of a polyimide adhesive

The polyimide(PI) structure in a unknown PI type adhesive was analyzed with FT-IR,NMR,GC and HPLC methods.The analysis results showed that the PI adhesive was polymerized by 3,3′-diaminodiphenyl sulphone and 3,4,3′,4′-biphenyl tetracarboxylic dianhydride(BPDA) in the NMP.