材料科学
活化能
纳米尺度
扩散
动能
结晶
热的
多孔性
表面扩散
化学工程
Crystal(编程语言)
表面能
化学物理
热氧化
热能
化学反应
扩散阻挡层
多孔介质
动力学
纳米技术
Atom(片上系统)
大气(单位)
纳米结构
晶体结构
化学能
流量(数学)
原子扩散
复合材料
传热
催化作用
热处理
作者
Yiqi Zhu,Ji Ma,Jiangbin Su,Lei Zhou,Meiping Jiang,Xianfang Zhu
出处
期刊:Nanotechnology
[IOP Publishing]
日期:2019-04-29
卷期号:30 (33): 335711-335711
被引量:10
标识
DOI:10.1088/1361-6528/ab1da1
摘要
Abstract In this work, the instabilities at the nanoscale (i.e. nanoinstabilities) of triangular pyramids-like Cu 2 O porous nanostructured films (PNFs) are studied by heating treatments under different atmosphere and temperature. It is found that the nanoscale building triangular pyramids turn round preferentially at the sharp angles and/or coalesce with their contacting ones by directional diffusion and plastic flow of atoms, which are driven by the nonuniformly-distributed surface nanocurvature. As a result, the triangular pyramids become quasi-sphere shape and the PNF evolves into a big, dense particles film. It is also observed that the heating or thermal activation effect efficiently promotes the reduction or oxidation of Cu 2 O pyramids and the crystallization or growth of the as-achieved Cu or CuO grains. The above physical and chemical instabilities or changes at the nanoscale of Cu 2 O PNFs can be well accounted for by the combined mechanism of nanocurvature effect and thermal activation effect. The nanocurvature effect can lower the energy barrier for the atom diffusion or plastic flow and lower the activation energy for the chemical reactions, while the thermal activation effect can supply the required kinetic energy or activation energy and make the atomic transportations and reactions kinetically possible. The findings reveal the evolution laws of morphology, crystal structure and composition of triangular pyramids-like Cu 2 O PNF during heating treatments, which can further be extended to other types of Cu 2 O PNFs. Also, the findings have important implications for the nanoinstabilities of Cu 2 O PNFs-based devices, especially those working at a high temperature.
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