Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

层流 传热 雷诺数 微通道 热流密度 机械 材料科学 散热片 强化传热 传热系数 热力学 物理 湍流
作者
Liang Gong,Krishna Kota,Wen‐Quan Tao,Yogendra Joshi
出处
期刊:Journal of heat transfer [ASM International]
卷期号:133 (5) 被引量:189
标识
DOI:10.1115/1.4003284
摘要

Wavy channels were investigated in this paper as a passive scheme to improve the heat transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric study of three-dimensional laminar fluid flow and heat transfer characteristics in microsized wavy channels was performed by varying the wavy feature amplitude, wavelength, and aspect ratio for different Reynolds numbers between 50 and 150. Two different types of wavy channels were considered and their thermal performance for a constant heat flux of 47 W/cm2 was compared. Based on the comparison with straight channels, it was found that wavy channels can provide improved overall thermal performance. In addition, it was observed that wavy channels with a configuration in which crests and troughs face each other alternately (serpentine channels) were found to show an edge in thermal performance over the configuration where crests and troughs directly face each other. The best configuration considered in this paper was found to provide an improvement of up to 55% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future high heat flux electronics.
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