数码产品
材料科学
带隙
辐射硬化
半导体
宽禁带半导体
工程物理
纳米技术
辐射
光电子学
电气工程
工程类
物理
光学
作者
Zahir Muhammad,Yan Wang,Yue Zhang,Pierre Vallobra,Shouzhong Peng,Songyan Yu,Ziyu Lv,Houyi Cheng,Weisheng Zhao
标识
DOI:10.1002/admt.202200539
摘要
Abstract The aspiration of electronic technologies that are resistant to high‐energy cosmic radiation is essential for current harsh radiation environment exploration. Integrated circuits mostly require post‐processing after designing, making their structures more complex than the standard systems. Thus, unique designs and strategies are developed to enable the high tolerance of space electronics to radiation in nuclear and avionic applications. The wide bandgap semiconductor (WBG) materials with excellent electronic/optical properties and structural stability are appealing options for radiation‐immune applications. Here, in this article, the development and fabrication of various electronic devices have been reviewed using different wide bandgap materials for radiation‐hardened applications. Detailed investigations are discussed, from the fundamental wide bandgap materials withstanding limited irradiation to the development processes of the electronic devices used in harsh environments. Furthermore, the challenges and future perspectives of the WBG‐based radiation harsh electronic devices are also highlighted in this review with commercial application in space stations and aircraft.
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