POSS/EHTPB synergistically toughened epoxy resin for cryogenic application

The high brittleness of epoxy resin at cryogenic temperature restricts their wide application in cryogenic engineering. In this study, polyhedral oligomeric silsesquioxane (POSS) with -Si-O-Si- molecular chains were synthesized, and the mechanical properties of diglycidyl ether of bisphenol A (E51 epoxy resin) were significantly enhanced at room temperature (RT) by incorporating a 4% POSS and curing agent 4,4′-diamino-diphenylmethane (DDM) as the E51/POSS/DDM resin system. Subsequently, by adding different contents of epoxidation hydroxyl-terminated polybutadiene (EHTPB) into the E51/POSS/DDM resin system, the EHTPB-E51/POSS/DDM resin system was prepared. The investigation into the impact of EHTPB content on the mechanical properties of EHTPB-E51/POSS/DDM resin system at room temperature (RT) revealed that EHTPB-E51/POSS/DDM resin system with 10% EHTPB exhibited the most favorable results. Specifically, the elongation at break, flexural strength, and critical stress intensity factor (KIC) were measured to be 6.82%, 143.75 MPa, and 1.83 MPa·m1/2, respectively. These values demonstrated a notable improvement of 53.3%, 26.9%, and 86.7% compared to those for the E51/DDM resin system. Concurrently, at 77 K, the elongation at break and critical stress intensity factor (KIC) increased by 37.8% and 73.5%, respectively. The toughening mechanism of the prepared EHTPB-E51/POSS/DDM resin system was further explored through resin-curing cross-linking simulation networks and SEM images of the fracture surface of resin samples. The study of EHTPB and POSS synergistically toughened epoxy resin provided a new efficient method to prepare epoxy resins with high toughness at low temperatures.