Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Abstract In this paper, the Inkjet printing technique is utilized to characterize the printed circuit performance with surface mount components when exposed to 50°C temperature. Functional circuits such as low pass and high pass filters are printed, and their frequency performance is studied against temperature. Additive electronics manufacturing is rapidly evolving with novel end applications due to the research efforts currently being pursued. A constant pressure of innovation is increasing on the state-of-art printing techniques to further the use and implementation that can help reduce manufacturing costs. The realization of functional additively printed circuits requires the ability to attach surface mount components on additively printed traces. However, the attachment of surface mount components on additively printed circuits is not well understood owing to the interaction of the process parameters with the realized performance of the attached components. This paper demonstrates some of the widely used circuits such as low-pass and high pass filters with surface mount components on additive printed traces. FHE has found applications in wearable product platforms. For wearable applications, it is common for electronics to sustain human body temperatures and temperature rise resulting from heat dissipation during operation. In order to simulate operational temperature exposure, the fabricated functional circuits are subjected to 50°C exposure. The viability of inkjet printed functional circuits with surface mount components and their response under sustained temperature exposure has been studied.