辐射硬化
航空航天
炸薯条
辐射
抗辐射性
计算机科学
芯片上的系统
嵌入式系统
工程类
航空航天工程
物理
电信
量子力学
作者
Dan Cheng,Dan Qi,Mo Chen
标识
DOI:10.1109/icicm50929.2020.9292308
摘要
Due to space application scenarios, radiation hardening techniques should be applied on aerospace SoC. This paper introduces an integrated test method for radiation-hardened SoC, which combines traditional scan chain and Memorybist designs, and new TMD chain and RAM test designs to verify the performance of rad-hardened SoC. The design of scan chain and Memorybist can be applied to the rapid screening of chips after tapeout. TMD chain and RAM test can verify the radiation-hardened performance of the chip in radiation experiments. The whole test design is flexible and configurable with high test coverage, and it is helpful to analyze the malfunction and radiation resistance of the chip.
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