Development of through glass vias (TGV) and through quartz vias (TQV) for advanced packaging

Through via formation is definitely the key for coming the advanced packaging which includes heterogeneous integration and high speed wireless communication. Glass and fused silica are well known as a great candidate for a core material for high frequency application as a result of high bulk resistance and lower dielectric loss. One of the important subjects in order to use through glass vias (TGV) and through quartz vias (TQV) substrates is “handling” due to a brittleness of glass. However, the mechanical strength of TGV substrate and its evaluation approach is not enough reported so far. This study shows the latest TGV/TQV formation and the mechanical strength of glass as well as methodological investigation.