Research and Development of the optimal dicing tape for use in a Plasma Dicing Environment

This thesis describes an investigation of the suitability of standard semiconductor dicing tape when used in plasma dicing applications. The traditional methods of dividing a fully processed semiconductor wafer into individual integrated circuits are cleaving, sawing or laser based. These are all physical techniques and tape properties have been developed to ensure optimum performance for these processes. Conversely, plasma dicing is less physical as the material between each device is eliminated at the atomic level using a gentle chemical process. The properties of standard dicing tapes have been designed to withstand the rigors of the well-established device singulation techniques. However, they have not been fully investigated when exposed to a high vacuum plasma environment. The aim of this program of work was to characterise the performance of dicing tape when subjected to conditions unique to those in a plasma dicing reactor. Results have helped in providing more accurate tape recommendations to semiconductor IC fabrication companies but with the involvement of several major dicing tape manufacturers, have also served as the insight and motivation to support further development of dicing tape for use in plasma dicing throughout the industry.