Low dielectric constant polymers for microelectronics

A large variety of polymers has been proposed for use as materials with low dielectric constants for applications in microelectronics. The chemical structures and selected properties of these polymers are discussed in this review. Polyimides, heteroaromatic polymers, poly(aryl ether)s, fluoropolymers, hydrocarbon polymers without any polar groups, films deposited from the gas phase by chemical vapor deposition, plasma enhanced chemical vapor deposition and other techniques are included. Based on the properties described so far, and the requirements for applications as intermetal dielectric material, conclusions regarding the possibilities for further developments are drawn.