Multiple electron-beam lithography

A number of multiple electron-beam approaches are currently under evaluation for sub-100-nm lithography. These approaches offer the potential of improving throughput for direct wafer writing and mask patterning and could have far reaching implications for the semiconductor industry. A brief review of important examples of these approaches are given with a discussion on throughput. The current status of two specific approaches, the microcolumn and the single column with a multiple electron-beam source (photocathode), are reported. In particular, a more detailed review of the recent advances in the microcolumn technology is presented.