合金
材料科学
降水
电阻率和电导率
极限抗拉强度
铜
冶金
延伸率
电导率
沉淀硬化
导电体
复合材料
化学
电气工程
物理
工程类
物理化学
气象学
作者
Bingbing Shi,Hong Du,Wenweijiao Wang,Longshui Su,Chen Wang,Lei Xiao,Tianyu Ma,Jianhui Zhou
标识
DOI:10.1002/adem.202300944
摘要
The Cu–1.1 wt% Hf–0.1 wt% Si alloy containing various precipitates is studied as a novel precipitation‐strengthened alloy with high strength and high electrical conductivity. The Cu–Hf–Si alloy prepared by solution, cold rolling, and aging processes exhibits a hardness of 238.92 HV, a tensile strength of 691.01 MPa, a breaking elongation of 15.09%, and an electrical conductivity of 62.34% International Annealed Copper Standard. The optimal peak aging parameter for Cu–Hf–Si alloy is 430 °C for 90 min. The precipitation of Hf and Si atoms from the Cu matrix is helpful to enhance the electrical conductivity. The precipitation of Hf can produce fibrous Guinier Preston zone and γ' precipitate, as well as spherical Cu 10 Hf 7 phases. In addition, the coprecipitation of Si and Hf can also produce Hf 3 (Cu 2 Si) 2 and HfCuSi phases. The high strength of Cu–Hf–Si alloy is mainly due to the multiprecipitates synergistic strengthening.
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