材料科学
微电子
热稳定性
各向异性
工作(物理)
热导率
热的
剪切模量
接口(物质)
弹性模量
图层(电子)
复合材料
锡
方向(向量空间)
凝聚态物理
光电子学
热力学
冶金
化学
光学
有机化学
几何学
数学
毛细管作用
物理
毛细管数
作者
Lei Li,Xueyan Yan,Bong-Jun Yang,Sen Yang,Alex A. Volinsky,Xiaolu Pang
标识
DOI:10.1016/j.cplett.2023.140649
摘要
AlN substrates are widely used in power modules and have high thermal conductivity and good insulation performance. In order to study the thermal stability of AlN substrates coated with the active metal, the AlN/Ti interface structure and the temperature dependence of the AlN layer orientation were investigated using the first principles calculations. The calculated work of separation and distance at elevated temperatures demonstrated good thermal stability of the interface. Elastic and shear modulus were calculated for the interface elastic anisotropy analysis and a certain orientation dependence was found. This study is helpful for the development of novel high-power microelectronic devices.
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