材料科学
欧姆接触
肖特基势垒
光电子学
二极管
阻挡层
兴奋剂
当前拥挤
击穿电压
肖特基二极管
电流密度
图层(电子)
电流(流体)
电压
电气工程
复合材料
工程类
物理
量子力学
作者
Cristyan Quiñones-García,Dolar Khachariya,Pramod Reddy,Seiji Mita,Jack Almeter,Pegah Bagheri,Shashwat Rathkanthiwar,Ronny Kirste,Spyridon Pavlidis,E. Kohn,Ramón Collazo,Zlatko Sitar
标识
DOI:10.35848/1882-0786/ad81c9
摘要
AlN Schottky barrier diodes with low ideality factor (<1.2), low differential ON-resistance (<0.6 mΩ cm 2 ), high current density (>5 kA cm −2 ), and high breakdown voltage (680 V) are reported. The device structure consisted of a two-layer, quasi-vertical design with a lightly doped AlN drift layer and a highly doped Al 0.75 Ga 0.25 N ohmic contact layer grown on AlN substrates. A combination of simulation, current–voltage measurements, and impedance spectroscopy analysis revealed that the AlN/AlGaN interface introduces a parasitic electron barrier due to the conduction band offset between the two materials. This barrier was found to limit the forward current in fabricated diodes. Further, we show that introducing a compositionally-graded layer between the AlN and the AlGaN reduces the interfacial barrier and increases the forward current density of fabricated diodes by a factor of 10 4 .
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