Miniature and Symmetrical Transformer Based on Through-Silicon Vias

A high-density symmetrical transformer based on through-silicon via (TSV) is proposed in this article. The primary winding and secondary winding have strong symmetry, and the inductance mismatch is less than 0.1%, so the transformer structure is suitable for differential circuit. Compared with transformers in other literatures, the proposed transformer has advantages in area and efficiency, which is reflected in that the on-chip area is greatly reduced by 58% to 89%, and the coupling coefficient can reach more than 0.92.