材料科学
制作
数码产品
柔性电子器件
激光器
激光烧蚀
光电子学
电子线路
印刷电子产品
基质(水族馆)
电极
纳米技术
光学
电气工程
复合材料
墨水池
物理化学
医学
替代医学
化学
病理
海洋学
工程类
地质学
物理
作者
Ruzhan Qin,Mingjun Hu,Naibai Zhang,Zhongyue Guo,Ze Yan,Jiebo Li,Jinzhang Liu,Guangcun Shan,Jun Yang
标识
DOI:10.1002/aelm.201900365
摘要
Abstract Attributed to high power density and controllable digital program operation, lasers are a powerful tool in the preparation, prototype fabrication, and post‐processing of materials. In this paper, a general laser ablation strategy that can be conducted under ambient, room‐temperature, and mask‐free conditions is employed for the rapid fabrication of robust large‐area copper‐based flexible electronics. Micrometer‐scale thick copper layer cladded on flexible polymer substrate can be removed efficiently in one laser scanning pass based on laser‐induced heat evaporation effect. Metal grids with a width less than 10 microns and a thickness close to 2 microns can be produced in a reliable manner. As proof‐of‐concept demonstrations, flexible transparent conducting electrodes and a variety of flexible circuit boards (FCBs) with different precisions and dimensions are fabricated by this approach in a digitally controlled mode and their photoelectric properties under normal and deformation states are investigated. The results indicate that the method is robust and as‐prepared flexible electrodes and circuits are reliable and endurable, indicative of the potential of this method in scalable fabrication of sub‐millimeter flexible electronics through a straightforward and flexible fashion.
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