材料科学
晶界
晶界滑移
航程(航空)
复合材料
图层(电子)
大气温度范围
边界(拓扑)
凝聚态物理
热力学
微观结构
数学分析
物理
数学
作者
Denis Klimenko,Yu. R. Kolobov,М. И. Карпов,V. P. Korzhov,Е. В. Голосов,I. V. Ratochka
出处
期刊:Nanotechnologies in Russia
[Springer Nature]
日期:2013-11-01
卷期号:8 (11-12): 783-788
被引量:3
标识
DOI:10.1134/s1995078013060098
摘要
The mechanical properties of two types of laminated Cu/Nb composites (with layer thicknesses in the range of 10–12 mm and 10–18 nm, respectively) are investigated in the temperature range of 773–1073 K. The possibility of the manifestation of grain boundary and interfacial sliding along the internal interfaces of the studied materials is examined.
科研通智能强力驱动
Strongly Powered by AbleSci AI