材料科学
氮化硼
复合材料
电介质
热导率
天然橡胶
表面改性
复合数
化学工程
光电子学
工程类
作者
Dan Yang,Yufeng Ni,Xinxin Kong,Dahai Gao,Yan Wang,Tingting Hu,Liqun Zhang
标识
DOI:10.1016/j.compscitech.2019.04.016
摘要
Owing to the development of modern micro-electronic devices, polymer composites with high thermal conductivity and low dielectric constant have become increasingly important. Herein, a combination of covalent and non-covalent modification was used to functionalize boron nitride (BN) platelets via first deposition with poly(dopamine) (PDA) followed by grafting with γ-methacryloxypropyl trimethoxy silane (KH570) (denoted as BN-PDA-KH570). The as-prepared BN-PDA-KH570 platelets were incorporated into the natural rubber (NR) matrix to prepare thermal conductive composites. After modification with PDA-KH570, the BN platelets were uniformly dispersed into the NR matrix, which is beneficial for improving the thermal conductivity of NR. The interfacial thermal resistance of the composites was also reduced due to the stronger interfacial interaction via vulcanization of NR with double bonds in KH570. Thus, the NR composites filled with 30 vol% BN-PDA-KH570 platelets exhibited a relatively high thermal conductivity of 0.39 W/mK, which is about 1.5 times and 4 times of 30 vol% BN/NR composite (0.26 W/mK) and pure NR (0.10 W/mK), respectively. In addition, the BN-PDA-KH570/NR composites exhibited a low dielectric constant (3.51 at 100 Hz) and a low dielectric loss tangent (0.25 at 100 Hz), which holds promising applications as thermal management materials for electronic devices.
科研通智能强力驱动
Strongly Powered by AbleSci AI