材料科学
晶体管
氧化铟锡
锡
光电子学
铟
电介质
电气工程
分析化学(期刊)
纳米技术
图层(电子)
化学
电压
色谱法
工程类
冶金
作者
Shengman Li,Mengchuan Tian,Chengru Gu,Runsheng Wang,Mengfei Wang,Xiong Xiong,Xuefei Li,Ru Huang,Yanqing Wu
标识
DOI:10.1109/iedm19573.2019.8993488
摘要
In this paper, we report high-speed ultrathin-body (3.5 nm) indium-tin-oxide (ITO) transistors using high-k HfLaO dielectrics with a thickness of 5 nm. Because of its low dielectric constant and large bandgap, ITO is a promising channel material for scaling below the 5 nm regime for advanced low-power electronics with excellent short-channel-immunity. Here, we fabricate sub-100-nm channel length ITO transistors with ultrahigh on/off ratio near 10 11 and ultralow off-state current below 10 fA/μm. The 15-nm-long ITO transistor exhibits high performance with the maximum on-state current of 970 μA/μm and peak g m of 400 μS/μm at V ds = 0.5 V. NAND, NOR, and SRAM based on enhancement/depletion mode (E/D) inverters have achieved full rail-to-rail output characteristics and stable memory function. Finally, We demonstrated a stage delay of 0.49 ns/stage for a 5-stage ring oscillator based on bootstrapped mode (BST) inverter, which is the best among all results based on metal-oxides transistors.
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