环氧树脂
材料科学
复合材料
石墨烯
热导率
复合数
聚氨酯
复合环氧材料
电阻率和电导率
保温
纳米技术
电气工程
工程类
图层(电子)
作者
Dineshkumar Mani,Minh Canh Vu,Tae‐Hyeong Jeong,Jun‐Beom Kim,Choong‐Sun Lim,Jung-Hyuk Lim,Kyung Min Kim,Sung‐Ryong Kim
标识
DOI:10.1016/j.compositesa.2021.106585
摘要
Graphene-based polymer composites possess high thermal conductivity, unfortunately, the high electrical conductivity of these composites limits their application in electronic devices. To address this issue, we report on the thermally conducting yet electrically insulating graphene fluoride (GF) based epoxy composites. GF was coated on cell walls of polyurethane foam (PUF) by a cyclic assembly deposition process, and the [email protected] foam was subsequently compressed and infiltrated with epoxy resin. The resultant [email protected]/epoxy composite exhibited a thermal conductivity of 9.68 W·m−1·K−1 at 8.04 vol% of GF loading which was 51-folds higher than that of neat epoxy. The significant enhancement in thermal conductivity is attributed to the effective formation of 3D thermoconductive pathways of GF in epoxy matrix. Additionally, the [email protected]/epoxy composites possess an electrical insulating property (10−9 S·m−1). This approach exhibits a cost-effective method to fabricate the thermoconductive composites with electrical insulation that could be applied for thermal management in electronic applications.
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