材料科学
捆绑
光学
光纤
纤维束
图像拼接
炸薯条
陶瓷
计算机科学
物理
电信
复合材料
作者
Jiali Jiang,Xin Zhou,Jiaying Liu,Likang Pan,Ziting Pan,Fan Zou,Ziqiang Li,Feng Li,Xiaoyu Ma,Chao Geng,Jing Zuo,Xinyang Li
出处
期刊:Sensors
[MDPI AG]
日期:2021-12-25
卷期号:22 (1): 127-127
被引量:4
摘要
We propose an imaging method based on optical fiber bundle combined with micro-scanning technique for improving image quality without complex image reconstruction algorithms. In the proposed method, a piezoelectric-ceramic-chip is used as the micro-displacement driver of the optical fiber bundle, which has the advantages of small volume, fast response speed and high precision. The corresponding displacement of the optical fiber bundle can be generated by precise voltage controlling. An optical fiber bundle with core/cladding diameter 4/80 μm and hexagonal arrangement is used to scan the 1951 USAF target. The scanning step is 1 μm, which is equivalent to the diffraction limit resolution of the optical system. The corresponding information is recorded at high speed through photo-detectors and a high-resolution image is obtained by image stitching processing. The minimum distinguishable stripe width of the proposed imaging technique with piezoelectric-ceramic-chip driven micro-scanning is approximately 2.1 μm, which is 1 time higher than that of direct imaging with a CCD camera whose pixel size is close to the fiber core size. The experimental results indicate that the optical fiber bundle combined with piezoelectric-ceramic-chip driven micro-scanning is a high-speed and high-precision technique for high-resolution imaging.
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