材料科学
聚酰亚胺
纳米复合材料
复合材料
硅氧烷
电介质
热稳定性
聚合物
化学工程
图层(电子)
光电子学
工程类
作者
P. Prabunathan,Srinivasan Krishnan,Jang‐Kun Song,M. Alagar
标识
DOI:10.1177/0954008317709891
摘要
In this work, a novel polyimide (PI) was prepared using bis(4-aminophenoxy)dimethylsilane and napthyldianhydride and the resulting PI was further reinforced with varying weight percentages (1%, 3%, 5%, and 10 wt%) of amine-functionalized bio-silicon (FSi) derived from rice husk to obtain hybrid nanocomposites. The dielectric, thermal, surface, and ultraviolet (UV) shielding properties of both PI and hybrid PI nanocomposites were thoroughly investigated. It was observed that the reinforced FSi acts as a mini capacitor embedded in the PI packing and contributes to high dielectric constant (5.8) as well as low dielectric loss. Moreover, the distribution of FSi throughout the PI matrix also offers superior hydrophobicity (95.1° in water) and enhanced thermal stability (36% char yield) to those of neat PI. Furthermore, the hybrid nanocomposites possess higher UV shielding behavior in both UV-A (97.2%) and UV-B (95.8%) region than those of neat PI. Based on the experimental findings, it is concluded that the bio-mass-based FSi-reinforced PI nanocomposites can be utilized as printed circuit board material or antistatic coating material with improved performance and enhanced longevity under different environments.
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