Advances in In Situ Boron and Phosphorous Doping of SiGeSn

Dopant concentrations higher than 1 × 10 19 cm −3 are required to improve the performances of various GeSn based devices such as photodetectors, electrically pumped lasers and so on. In this study, the in situ Boron and Phosphorous doping of SiGeSn was investigated, building upon recent studies on in situ B or P doped GeSn. The surfaces of intrinsic and lowly doped pseudomorphic SiGeSn layers were rough. By contrast, a 〈110〉 cross hatch was recovered and surfaces as smooth as the Ge Strain-Relaxed Buffers underneath were obtained for the highest B 2 H 6 or PH 3 mass-flows. The surface Root Mean Square roughness and Z range values were then as low as 0.36 nm and 2.86 nm for SiGeSn:B, and 0.47 nm and 4.60 nm for SiGeSn:P. In addition, Si contents as high as 25% were obtained, notably in SiGeSn:B layers. Dopants were almost fully electrically active in those SiGeSn:B and SiGeSn:P layers, with carrier concentrations as high as 2.0 × 10 20 cm −3 and 2.7 × 10 20 cm −3 , respectively. For SiGeSn:P, the shortcoming of in situ doped GeSn:P was overcome, that is the formation of electrically inactive Sn m P n V clusters for high PH 3 mass-flows. Such electrically active carrier concentrations will be beneficial for (Si)GeSn based devices, but also for all Group-IV based devices with extremely low thermal budget constraints.