模具(集成电路)
收发机
逆变器
CMOS芯片
光子学
光电子学
中间层
电子工程
炸薯条
电气工程
材料科学
计算机科学
工程类
电压
图层(电子)
纳米技术
蚀刻(微加工)
作者
Yoshinori Nishi,John W. Poulton,Walker J. Turner,Xi Chen,Sanquan Song,Brian Zimmer,Stephen G. Tell,Nikola Nedovic,John Wilson,William J. Dally,C. Thomas Gray
出处
期刊:IEEE Journal of Solid-state Circuits
[Institute of Electrical and Electronics Engineers]
日期:2023-01-09
卷期号:58 (4): 1062-1073
被引量:36
标识
DOI:10.1109/jssc.2022.3232024
摘要
This article presents a clock-forwarded, inverter-based short-reach simultaneous bi-directional (ISR-SBD) physical layer (PHY) targeted for die-to-die communication over silicon interposers or similar high-density interconnect. Short-reach links of this type are increasingly important to support larger systems built with chiplets and multiple die and to facilitate the shift to medium- and long-range optical communication based on silicon photonics. This project explores the advantages of simultaneous bi-directional signaling (SBD) over other bandwidth-doubling techniques (e.g., PAM4). Fabricated in a 5-nm standard CMOS process, the ISR-SBD PHY demonstrates 50.4 Gb/s/wire (25.2 Gb/s each direction) and 0.297 pJ/bit on a 750-mV supply over a 1.2-mm on- chip channel.
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