A novel and effective approach to enhance the interfacial interactions of meta-aramid fibers

Meta-aramid paper exhibits some unique properties, including high temperature resistance, electrical insulation. However, due to the inherent chemical inertness of aramid fibers, the interfacial bonding between fibers is weak, which negatively affect the properties of aramid paper. Herein, we report a simple, effective and scalable process for substantially improving the interfacial bonding between aramid fibers, thus, mechanical and insulating properties of the meta-aramid composite paper, and it was achieved by surface coating of aramid paper with meta-aramid stock solution that contains N, N dimethylacetamide (DMAc)-CaCl2 and high molecular weight poly (m-phenylene isophthalamide) polymers. Results show that the tensile strength, modulus, internal bond strength and tearing index of the resultant all-PMIA paper increased by 83 %, 58 %, 173 % and 89 %, respectively, in comparison with those of the control. The breakdown strength of the improved aramid paper is 190 % higher than that of the control paper, attaining 26.46 KV/mm. This work provides a simple, economical, efficient, and scalable method to improve the overall performance of meta-aramid paper, which has great potential to be implemented at the industrial scale.