材料科学
铜
接触角
腐蚀
X射线光电子能谱
冶金
复合数
扫描电子显微镜
复合材料
化学工程
工程类
作者
Yunxiang Shu,Xiangyou Lu,Wansu Lu,Wenbo Su,Ying-Qing Wu,Honghong Wei,Dianguo Xu,Jie Liang,Yahong Xie
标识
DOI:10.1016/j.surfcoat.2022.129216
摘要
This paper uses a new method combining nanosecond laser processing technology and sol-gel to design and manufacture mechanically robust micro-nano structure and modified SiO2@PDMS coating on copper substrate. The superhydrophobic composite surface was successfully synthesized with a water contact angle of 159.5° and a sliding angle of 0.5°. The characterization of the prepared superhydrophobic surface #3 (laser-textured@SiO2@PDMS protective layer) was studied by optical profilometry, scanning electron microscopy, FT-IR spectroscopy, and X-ray photoelectron spectroscopy. The composite structure of micron/nano and organic/inorganic 3D interwoven network can be observed to improve the hydrophobic, wear-resistant, and compressive properties of the substrate surface. FT-IR spectra fully indicate the presence of PDMS and Si (CH3) grafted onto SiO2 particles on the copper surface, and the presence of SiO and SiC detected by XPS fully proves the FT-IR results. In addition, self-cleaning, wear resistance, anti-icing, corrosion resistance, and NaCl deliquescence behavior were evaluated. The results show that surface #3 can efficiently remove contaminants within 200 s. In the anti-icing experiment, the delayed icing time and ice adhesion strength of surface #3 are 3.33 times and 1.99 % of that of the ordinary copper surface, respectively, which can make the icicle slide easily. In the electrochemical test, the corrosion current density decreased by an order of magnitude, and the corrosion inhibition efficiency reached 90.57 %. Based on its excellent self-cleaning, mechanical robustness, anti-icing, and anti-corrosion properties, we believe that the composite modified surface of the laser-textured@SiO2@PDMS protective layer designed and manufactured in this study is expected to be used in engineering fields such as refrigeration heat exchangers.
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