结温
功率(物理)
计算机科学
电气工程
拓扑(电路)
物理
工程类
热力学
作者
Ying Wang,Xi Jiang,Song Yuan,Shijie Zhang,Daoyong Jia,Runze Ouyang,Nianlong Ma,Xiaowu Gong
标识
DOI:10.1109/peds57185.2023.10268827
摘要
Accurate junction temperature estimation is essential in power module applications to ensure optimal performance, reliability, and lifespan. This paper investigates the impact of threshold voltage $(V_{th})$ mismatch on in-situ junction temperature estimation for SiC MOSFET multichip power module based on the turn-ON delay time $(t_{d,on})$ . The $t_{d, \text { on }}$ of power modules and its temperature dependence are related to the $V_{th}$ of each chip within the power module. Simulations on the $V_{th}$ mismatch of paralleled MOSFETs demonstrate that selecting a larger reference triggering voltage of $V_{s_{-}ref}$ enables the extraction of the mean junction temperature based on the $t_{d,on}$ of the power module. Moreover, the $V_{th}$ mismatch has almost no effect on the accuracy of the mean junction temperature estimation. Finally, calibration experiments are performed on a commercial half-bridge SiC MOSFET power module with $t_{d,on}$ extraction circuit. Experimental results show that the $t_{d,on}$ of SiC MOSFET power module has a linear temperature coefficient of $150\text{ps}/^{\circ}\mathrm{C}$ at the turn-ON resistance of $15\Omega$ and is independent of load current.
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