材料科学
热等静压
高温合金
接头(建筑物)
极限抗拉强度
合金
冶金
位错
晶界
微观结构
复合材料
工程类
建筑工程
作者
Guangxu Liu,Fangrui Lin,Jie Yang,Xiaofeng Wang,Jinwen Zou
标识
DOI:10.1016/j.matlet.2022.133000
摘要
• Hot isostatic pressing eliminated weakly bonded area and microvoid at interface. • Hot isostatic pressing promoted migration of grain boundaries at the interface. • Dislocation density at the interface was decreased by hot isostatic pressing. • Tensile properties of the bonded joints were improved by hot isostatic pressing. Tensile properties of an advanced powder metallurgy (PM) Ni based superalloy diffusion bonded joints were significantly improved by hot isostatic pressing (HIP) and the improvement mechanism was studied. Results showed that HIP treatment eliminated the weakly bonded areas and microvoids at the interface. In addition, HIP treatment also significantly promoted the migration of grain boundaries and decreased the dislocation density at the interface. After HIP treatment, the ultimate tensile strength of the joint bonded using a 2-μm-thick Ni coating reached 98.63% of the base alloy following the same thermal cycle.
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