T. Fukada,Woo Sik Yoo,Yasuhide Hiraga,K. Kang,R. Komatsubara
标识
DOI:10.1109/rtp.2001.1013753
摘要
To overcome the disadvantages of batch furnaces and single wafer rapid thermal processing (RTP) systems, a single wafer furnace (SWF) is designed. In this paper, wet oxidation is investigated using the SWRTF system. Oxide film thickness and uniformity were investigated as a function of temperature and process time.