材料科学
微观结构
板条
马氏体
奥氏体
退火(玻璃)
冶金
透射电子显微镜
复合材料
无扩散变换
光学显微镜
扫描电子显微镜
能量色散X射线光谱学
奥氏体不锈钢
压痕硬度
形状记忆合金
光谱学
显微镜
作者
Taisuke Hayashi,Eiji Abe,Toru Hara,Yuichi Ikuhara
出处
期刊:Isij International
[The Iron and Steel Institute of Japan]
日期:2009-01-01
卷期号:49 (9): 1406-1413
被引量:7
标识
DOI:10.2355/isijinternational.49.1406
摘要
The microstructure evolution at interfaces of a layer-integrated steel sheet artificially constructed by ductile austenitic stainless (SUS304) and high-strength martensitic (SCM415) steel layers, which were bonded through a cold-rolling and a subsequent annealing at 1000°C, has been investigated using scanning transmission electron microscopy (STEM) combined with energy dispersive X-ray spectroscopy (EDS). We find that a significant microstructural reconstruction around the SUS304/SCM415 interface has been accomplished during a short-time annealing followed by water-quenching; the resultant microstructures are found to consist of recrystallized austenite and lath martensite grains for the SUS304 and SCM415 layers, respectively. Interestingly, the original SUS304/SCM415 interface appears to migrate and extend into the SUS304 side, an occurrence of which can be reasonably explained by the martensitic transformation across the composition-gradient interface during quenching. These microstructural evolutions fairly account for a microscopic mechanism on how hetero-interface bonding can be achieved via simple cold-rolling/annealing procedures.
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