生产线后端
可靠性(半导体)
材料科学
灵活性(工程)
直线(几何图形)
电气工程
计算机科学
图层(电子)
晶体管
光电子学
电子工程
插入损耗
功率(物理)
工程类
电介质
电压
物理
纳米技术
统计
量子力学
数学
几何学
作者
Qiang Yu,Jeffrey Garrett,James Waldemer,Yunzhe Ma,Surej Ravikumar,Guannan Liu,Said Rami
标识
DOI:10.1109/ims19712.2021.9574903
摘要
This paper presents a mmWave switch designed using novel back-end-of-line (BEOL) in Intel 22nm FinFET (22FFL) technology. In the newly developed mmWave BEOL, ExpressVia is introduced, which allows direct transistor connection to thick metal layer. Continuous via and 3+1 thick metal layers are also enabled to provide design flexibility. Taking advantage of the new features, an ultra-wideband (DC-60GHz) series SPST switch is implemented in this technology achieving 1.9dB insertion loss, 21.0dB isolation, 17.3dB return loss, 24.1dBm IP1dB, 35.9dBm IIP3 at 28GHz within an active area of 0.00176mm2. Reliability measurements show the switch can handle up to 24.9dBm of power at 28GHz. The measured ${\mathrm{R}_{\text{on}}}^{\ast}\mathrm{C}_{\text{off}}$ at top metal is 107fs, which is well suited for emerging 5G applications.
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