材料科学
焊接
可伸缩电子设备
导线
数码产品
导电体
纳米技术
液态金属
复合材料
电气工程
工程类
作者
Minwoo Kim,Jung Jae Park,Chulmin Cho,Seung Hwan Ko
标识
DOI:10.1002/adfm.202370214
摘要
Room Temperature Soldering In article number 2303286, Seung Hwan Ko and co-workers present a room-temperature universal stretchable sticker-like soldering process that stretchably solders multiple spots at once and fabricates a stretchable device in an in situ manner while a target conductor is installed on one's body. This process allows the integration of stretchable conductors with advanced chips for next-generation stretchable electronics.
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