A State-of-the-Art Review of Fracture Toughness of Silicon Carbide: Implications for High-Precision Laser Dicing Techniques

Silicon carbide (SiC) stands out for its remarkable hardness, thermal stability, and chemical resistance, making it a critical material in advanced engineering applications, particularly in power electronics, aerospace, and semiconductor industries. However, its inherent brittleness and relatively low fracture toughness pose significant challenges during precision manufacturing processes, particularly during the laser stealth dicing—a pivotal process for wafer separation. This review provides a comprehensive analysis of the fracture toughness of SiC, exploring its dependence on microstructural factors, such as grain size, fracture mode (transgranular vs. intergranular), and toughening mechanisms, including the crack deflection and bridging. The effects of temperature and mechanical anisotropy on the fracture resistance of SiC are discussed. Particular attention is given to how SiC’s low fracture toughness and brittle nature affect the controlled crack propagation critical to the dicing process. The review synthesizes key experimental findings from various fracture-toughness measurement techniques, highlighting their relevance for optimizing the laser processing parameters. By linking the fracture mechanics of SiC to its performance in laser stealth dicing, this review provides critical guidance for enhancing the process, ensuring greater efficiency and reliability in SiC wafer separation for advanced technologies.